SL220B/W
This product is a single component room temperature hardening adhesive based on methylsilyl end polymers and does not contain organotin compounds. Comply with REACH rules; Not using 6 substances specified by ROHS; Does not contain low molecular weight cyclic polysiloxanes that cause contact barriers; As it is an elastomer, it will not cause dislocation of adhesive materials, and can resist thermal shock; Fast curing speed
key word:
HENGYING
Category:
Konishi
Konishi
Hotline:
SL220B/W
| Product number | color | Surface dry time | viscosity | hardness | Single and double components | Packing Specifications | application market | Typical use |
| SL220B/W | black White | 6-15min | 90000-200000 | A50 | single component | 120ml/piece 333ml/piece |
Electronics | As a material for bonding electrical and electronic parts and as a filling resin, it is most suitable for other applications where the use of tin compound additives is restricted |
RELATED PRODUCTS