SL210LB
This product is a single component room temperature hardening adhesive based on methylsilyl end polymers and does not contain organotin compounds. Comply with REACH rules; Not using 6 substances specified by ROHS; Does not contain low molecular weight cyclic polysiloxanes that cause contact barriers; As it is an elastomer, it will not cause dislocation of adhesive materials, and can resist thermal shock; Fast curing speed.
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Konishi
Konishi
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SL210LB
| Product number | color | Surface dry time | viscosity | hardness | Single and double components | Packing Specifications | application market | Typical use |
| SL210LB | black | 2.5-7.5min | 14000-30000 | A34 | single component | 120ml/piece 333ml/piece |
Electronics | As a material for bonding electrical and electronic parts and as a filling resin, it is most suitable for other applications where the use of tin compound additives is restricted. Can be used to bond the diaphragm of the silicon film, resistant to high temperature and high humidity |
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