SL277LF
This product is a single component room temperature hardening adhesive based on methylsilyl end polymers and does not contain organotin compounds. Comply with REACH rules; Not using 6 substances specified by ROHS; Does not contain low molecular weight cyclic polysiloxanes that cause contact barriers; As it is an elastomer, it will not cause dislocation of adhesive materials, and can resist thermal shock; Fast curing speed.
key word:
HENGYING
Category:
Konishi
Konishi
Hotline:
SL277LF
| Product number | color | Surface dry time | viscosity | hardness | Single and double components | Packing Specifications | application market | Typical use |
| SL277LF | black | 5-10min | 5000-12000 | A55 | single component | 333ml/piece | Electronics | As a material for bonding electrical and electronic parts and as a filling resin, it is most suitable for other applications where the use of tin compound additives is restricted. Black modified silica gel with phosphor added, suitable for automated production lines |
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