What are the characteristics of reactive hot melt adhesive (PUR)?
Reactive hot melt adhesive, also known as PUR hot melt adhesive, solvent-free, short time can be cured, high adhesion, good heat resistance, through cooling curing, through moisture reaction hardening. Ultra-narrow frame dispensing, the finest can do 0.2mm dispensing (before pressing); Fast hardening speed, the fastest only need 0.5-3 hours to enter the next process; Good thermal stability, after a long time of heating can also be stable glue; Shading performance, both black and white glue has the essence of shading function; Heavy duty (repairable), by heating can be relatively easy to remove the attached parts. Can be used in mobile phones and other electronic terminals TP screen and front shell bonding, or other parts of the structure bonding.
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